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EcoPeeler
is a transparent and inorganic chemical which does not contain any HDA
(hydroxyl amine), hazardous, toxic, or organic solvents. The pH of EcoPeeler
can be controlled to required levels so as to be compatible with various
processes. It is also a cost effective chemicals as there is no necessity for
additional facilities or cost associated with its disposal.
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to EcoPeeler Properties
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 KF1000
series
--Alminum wiring process (aluminum wiring and Via hole)
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Applications
 AI interconnection
Borderless process
Via Hole on AI and W interconnection
W interconnection
W bit
Metal impurities and particles |
| KF1010: |
Applicable for preventing corrosion of borderless
W plug |
| KF5010: |
Applicable for aluminum wiring process
combined with Via hole process
*Applicable for AI process, neutral type |
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AI interconnection
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to EcoPeeler Properties
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KF3000
series
---Copper wiring process
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Applications
Applicable for SiO2,
typical organic Low-k, MSQ, HSQ
Applicable for post
CMP cleaningEcoPeelerT KF3000 series
This series allows various types of Cu polymer
(With inoraganic low-k and organic low-k ILD) to be removed. |
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Dual-damascene process with th-SiO2
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to EcoPeeler Properties
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KF5000
series
---Process for metals with a high melting point (W, Ti, Ta, etc.)
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Applications
W poly metal gate
W bit
Via hole on W and CoSi interconnection
high dose ion implantation (after ashing)
(exp. As=5E+15, P=5E+15, B=5E+14)
metal impurities
and particles |
KF5010, KF5020, and KF5030
---Metal gate process
---Poly-Metal gate process
---Bit wiring process
---Post implantation photo resist remover
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Cosi Via-hole
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to EcoPeeler Properties
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KF6000
series
--Single wafer process, poly-metal gate process
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Applications
Removal of etching
residue of W poly metal gate
Removal of residue post ion implantation
Via hole on W interconnection
Removal of metal impurities and
particles
KF6527
KF6537
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Etching residue remover for W poly-metal gate
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