Semiconductor Materials and Equipment-Die Bonder-Parylene, Plastics Supplier Uniglobe Kisco, Inc.

Micro Focus X-ray Image TV System

Die Bonder/ In-line Curing Oven

EcoPeeler

Die Bonder / In-line Curing Oven

CPS-100VX

CPS-400F

CPS-500VX

High Speed Epoxy Die Bonder

Soft Solder Die Bonder

High Speed Eutectic Die Bonder

Features

	Bonding cycle time: 0.38 sec/die
	Equipped with newly developed high speed recording system SPAR-R30

	Digital direct solder wire supply system
	4 thermostatic control blocks
	Digitally set bond scrubbing
	Variety of temperature profiles

	Bonding cycle time: 0.28 sed/die
	Equipped with a SPA-RX30 high speed recognition unit
	Dip pick up force and mounting force digitally set

CPS-1800

CPM-8100

BCOS-III

High Speed Epoxy Die Bonder

CSP Die Bonder

In-line Curing Oven

Features

	Bonding cycle time: 0.5 sec/die
	For 8-inch wafers
	TBGA and stacked package (optional)

	Applicable devices: CSP, C4 (Flip Chip), TBGA (µBGA), LOC
	High accuracy: X, Y: 5 µm, theta: ±0.01°
	Applicable load range: 1kgf-50kgf (digital setting)
	Bonding area: X: 200mm, Y: 100mm

	Integrated system
	Uniform heating, clean curing, without contamination, for Cu lead frames
	Variety of temperature profiles